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种子哈希：4a9e8828475fdb7957562f59675e57a7b66c100e
文档大小：426.7 MB
文档个数：65个文档
下载次数：3133次
下载速度：极快
收录时间：2021-12-06
最近下载：2024-09-28
DMCA/屏蔽：DMCA/屏蔽

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~Get Your Files Here !/3. ELECTRONICS SUBSTRATE MATERIALS & THEIR FUNCTIONS IN THERMAL MANAGEMENT/1. INTRODUCTION TO SUBSTRATE MATERIALS CERAMIC POLYMERES METALS COMPOSITES.mp4 39.3 MB
~Get Your Files Here !/3. ELECTRONICS SUBSTRATE MATERIALS & THEIR FUNCTIONS IN THERMAL MANAGEMENT/3. ELECTRONIC GLASS.mp4 22.3 MB
~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/3. WHAT IS ELECTRONICS PACKAGING & ITS 2 BROAD CATEGORIES.mp4 21.9 MB
~Get Your Files Here !/4. YOUR PCB SUBSTRATE A GUIDE TO MATERIALS/2. TYPES OF CIRCUIT BOARD & ITS APPLICATIONS.mp4 20.9 MB
~Get Your Files Here !/3. ELECTRONICS SUBSTRATE MATERIALS & THEIR FUNCTIONS IN THERMAL MANAGEMENT/2. VARIOUS TYPES CERAMIC SUBSTRATE MATERIALS.mp4 20.2 MB
~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/6. HIERARCHY OF ELECTRONICS PACKAGING.mp4 20.2 MB
~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/9. CARBON NANO TUBES (CNTs).mp4 18.6 MB
~Get Your Files Here !/5. ADVANCED MATERIAL FOR TIM/1. USE OF GELVET OVER CONVENTIONAL TIMs.mp4 17.9 MB
~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/8. ROLE OF DIAMOND.mp4 15.6 MB
~Get Your Files Here !/5. ADVANCED MATERIAL FOR TIM/2. TECHNICAL DETAILS & CERTAIN DRAWBACKS OF GELVET TIMs.mp4 15.4 MB
~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/7. GOLD-GOLD INTERCONNECTION (GGI).mp4 15.0 MB
~Get Your Files Here !/2. PACKAGING CONFIGURATIONS/2. CERAMIC-FLAT-PACK SURFACE-MOUNT GRID-ARRAY-MATRIX CONFIGURATIONS.mp4 15.0 MB
~Get Your Files Here !/9. COURSE CLOSING SESSION/1. CONCLUSION.mp4 14.9 MB
~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/4. WHY DO WE NEED DEVICE PACKAGING COATING .mp4 13.2 MB
~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/1. INTRODUCTION TO MMCs.mp4 12.5 MB
~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/2. Al-DIAMOND MMC.mp4 12.3 MB
~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/7. 3 PACKAGING VARIATIONS CARD DCAM MCML.mp4 11.9 MB
~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/3. Al-SiC MMC.mp4 11.6 MB
~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/5. APPLICATIONS OF MATERIALS IN ELECTRONICS PACKAGING.mp4 11.0 MB
~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/5. Cu-DIAMOND MMC.mp4 10.1 MB
~Get Your Files Here !/8. ELECTROMAGNETIC SHIELDING (EMI)/1. ADVANCED MATERIALS USED FOR EMI SHIELDING IN ELECTRONICS.mp4 10.1 MB
~Get Your Files Here !/4. YOUR PCB SUBSTRATE A GUIDE TO MATERIALS/1. INTRODUCTION TO PCB.mp4 9.8 MB
~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/6. Al-GRAPHITE MMC.mp4 9.7 MB
~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/8. CONCEPT OF CHIP FIRST & CHIP LAST.mp4 9.3 MB
~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/2. OVERVIEW OF COURSE CONTENTS.mp4 7.6 MB
~Get Your Files Here !/2. PACKAGING CONFIGURATIONS/1. SINGLE-IN-LINE DUAL-IN-LINE ZIGZAG-IN-LINE QUAD -IN-LINE CONFIGURATIONS.mp4 6.8 MB
~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/1. SELF INTRODUCTION.mp4 6.4 MB
~Get Your Files Here !/7. PHASE CHANGE MATERIALS/1. MATERIALS USED IN PCM.mp4 6.4 MB
~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/4. Al-Si MMC.mp4 6.0 MB
~Get Your Files Here !/4. YOUR PCB SUBSTRATE A GUIDE TO MATERIALS/3. FR4 PCB BOARD.mp4 5.8 MB
~Get Your Files Here !/9. COURSE CLOSING SESSION/2. CLOSING SESSION.mp4 4.8 MB
~Get Your Files Here !/8. ELECTROMAGNETIC SHIELDING (EMI)/1.1 RESOURCE.pdf 4.1 MB
~Get Your Files Here !/3. ELECTRONICS SUBSTRATE MATERIALS & THEIR FUNCTIONS IN THERMAL MANAGEMENT/1. INTRODUCTION TO SUBSTRATE MATERIALS CERAMIC POLYMERES METALS COMPOSITES.srt 4.3 kB
~Get Your Files Here !/2. PACKAGING CONFIGURATIONS/1. SINGLE-IN-LINE DUAL-IN-LINE ZIGZAG-IN-LINE QUAD -IN-LINE CONFIGURATIONS.srt 3.2 kB
~Get Your Files Here !/3. ELECTRONICS SUBSTRATE MATERIALS & THEIR FUNCTIONS IN THERMAL MANAGEMENT/3. ELECTRONIC GLASS.srt 2.9 kB
~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/3. WHAT IS ELECTRONICS PACKAGING & ITS 2 BROAD CATEGORIES.srt 2.7 kB
~Get Your Files Here !/7. PHASE CHANGE MATERIALS/1. MATERIALS USED IN PCM.srt 2.6 kB
~Get Your Files Here !/4. YOUR PCB SUBSTRATE A GUIDE TO MATERIALS/2. TYPES OF CIRCUIT BOARD & ITS APPLICATIONS.srt 2.5 kB
~Get Your Files Here !/3. ELECTRONICS SUBSTRATE MATERIALS & THEIR FUNCTIONS IN THERMAL MANAGEMENT/2. VARIOUS TYPES CERAMIC SUBSTRATE MATERIALS.srt 2.4 kB
~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/1. INTRODUCTION TO MMCs.srt 2.4 kB
~Get Your Files Here !/5. ADVANCED MATERIAL FOR TIM/1. USE OF GELVET OVER CONVENTIONAL TIMs.srt 2.1 kB
~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/9. CARBON NANO TUBES (CNTs).srt 2.1 kB
~Get Your Files Here !/4. YOUR PCB SUBSTRATE A GUIDE TO MATERIALS/3. FR4 PCB BOARD.srt 2.0 kB
~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/6. HIERARCHY OF ELECTRONICS PACKAGING.srt 1.9 kB
~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/3. Al-SiC MMC.srt 1.8 kB
~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/8. ROLE OF DIAMOND.srt 1.8 kB
~Get Your Files Here !/2. PACKAGING CONFIGURATIONS/2. CERAMIC-FLAT-PACK SURFACE-MOUNT GRID-ARRAY-MATRIX CONFIGURATIONS.srt 1.7 kB
~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/2. Al-DIAMOND MMC.srt 1.7 kB
~Get Your Files Here !/5. ADVANCED MATERIAL FOR TIM/2. TECHNICAL DETAILS & CERTAIN DRAWBACKS OF GELVET TIMs.srt 1.6 kB
~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/5. Cu-DIAMOND MMC.srt 1.6 kB
~Get Your Files Here !/9. COURSE CLOSING SESSION/1. CONCLUSION.srt 1.6 kB
~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/2. OVERVIEW OF COURSE CONTENTS.srt 1.4 kB
~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/7. GOLD-GOLD INTERCONNECTION (GGI).srt 1.4 kB
~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/7. 3 PACKAGING VARIATIONS CARD DCAM MCML.srt 1.3 kB
~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/4. WHY DO WE NEED DEVICE PACKAGING COATING .srt 1.3 kB
~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/5. APPLICATIONS OF MATERIALS IN ELECTRONICS PACKAGING.srt 1.3 kB
~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/6. Al-GRAPHITE MMC.srt 1.0 kB
~Get Your Files Here !/4. YOUR PCB SUBSTRATE A GUIDE TO MATERIALS/1. INTRODUCTION TO PCB.srt 1.0 kB
~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/4. Al-Si MMC.srt 887 Bytes
~Get Your Files Here !/8. ELECTROMAGNETIC SHIELDING (EMI)/1. ADVANCED MATERIALS USED FOR EMI SHIELDING IN ELECTRONICS.srt 849 Bytes
~Get Your Files Here !/9. COURSE CLOSING SESSION/2. CLOSING SESSION.srt 819 Bytes
~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/8. CONCEPT OF CHIP FIRST & CHIP LAST.srt 703 Bytes
~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/1. SELF INTRODUCTION.srt 593 Bytes
~Get Your Files Here !/Bonus Resources.txt 357 Bytes
Get Bonus Downloads Here.url 176 Bytes

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